2007 INDUSTRY NOTES:
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Threads
Are Dead
This
DAC, Professor Wen-mei Hwu of UIUC said “Threads
are dead.” There are 2 issues affecting
EDA in the move to Multi-Core, Multi-Processing: first,
design; this year the cost of software development,
for an SoC, is passing the cost of the actual IC design.
This is actually a major opportunity for EDA vendors...
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The
Stickiness Factor
and Programming Models
The whole premise
of rapid development of complex chips using ESL techniques
is highly dependent on the availability of good programming
models…Think of the programming model as the new
reference board...
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DAC
#44 - the Pivotal DAC
Hopefully this is the turning
point ...mood was up...disappointment was the lack
of software engineers...we may have a terminology
problem...What we are trying to solve is parallel
processing problems; the multi-core, or really multi-processing
in general programming problem...
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DATE
2007:
DATE (Design, Automation and
Test in Europe) was extremely successful this year.
They have finally succeeded in turning D.A.T.E. into
a true Electronic System Design Conference.
This year I discovered five “Hot” issues:
Software, Software, Software, DFM and Power...
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EDP
2007:
EDP (Electronic Design Processes
Workshop) is the conference for design methodology
and there have been instances of large semiconductor
companies changing their research and, in some cases,
methodology based on what was said at an EDP conference.
EDP 2007, as usual, showcased the most pressing
problems in electronic design today: Power, DFM, and
Multi-core programmability...
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2006
INDUSTRY NOTES:
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Investment
in the CAD EDA industry:
The news that NXP
might be pulling out of the Crolles2 alliance
with ST Microelectronics and other partners
brings up some interesting questions...
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ICCAD:
The 2006 International
Conference on Computer Aided Design (ICCAD)
featured a panel session “CAD Research:
Pay Now or Pay Later”. The panel presenters
were tasked with addressing various issues
about the CAD EDA industry. Some of the most
important issues...
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Wafer:
MEPTEC’s (MicroElectronics
Packaging and Test Engineering Council’s)
Technical Symposium IC Packaging and Test
Roadmaps, held November 16, 2006, explored
future technology trends and solutions for
packaging and test. As demand increases for...
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