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Industry Notes are short summaries of events
that will affect the electronics design world.


What To See @ DAC 2007
This list details theHot New Products at DAC.The list is free to download.In order to receive permission to post the list on your website, you must purchase the Research Viewpoint

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WALLCHARTS:
ESL
Wallchart 2007

This Wallchart lists the ESL vendors by sub application
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download "ESL Wallchart 2007"
CAE
Wallchart 2007

This Wallchart lists the EDA vendors by sub application
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download CAE Wallchart 2007

CAD-CAM
Wallchart 2007

This Wallchart lists the EDA vendors by sub application
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download CAD-CAM Wallchart 2007



2007 INDUSTRY NOTES:
Threads Are Dead
This DAC, Professor Wen-mei Hwu of UIUC said “Threads are dead.” There are 2 issues affecting EDA in the move to Multi-Core, Multi-Processing: first, design; this year the cost of software development, for an SoC, is passing the cost of the actual IC design. This is actually a major opportunity for EDA vendors...
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The Stickiness Factor
and Programming Models
The whole premise of rapid development of complex chips using ESL techniques is highly dependent on the availability of good programming models…Think of the programming model as the new reference board...
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DAC #44 - the Pivotal DAC
Hopefully this is the turning point ...mood was up...disappointment was the lack of software engineers...we may have a terminology problem...What we are trying to solve is parallel processing problems; the multi-core, or really multi-processing in general programming problem...
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DATE 2007:
DATE (Design, Automation and Test in Europe) was extremely successful this year. They have finally succeeded in turning D.A.T.E. into a true Electronic System Design Conference. This year I discovered five “Hot” issues: Software, Software, Software, DFM and Power...
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EDP 2007:
EDP (Electronic Design Processes Workshop) is the conference for design methodology and there have been instances of large semiconductor companies changing their research and, in some cases, methodology based on what was said at an EDP conference. EDP 2007, as usual, showcased the most pressing problems in electronic design today: Power, DFM, and Multi-core programmability...
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2006 INDUSTRY NOTES:
Investment in the CAD EDA industry:
The news that NXP might be pulling out of the Crolles2 alliance with ST Microelectronics and other partners brings up some interesting questions...
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ICCAD:
The 2006 International Conference on Computer Aided Design (ICCAD) featured a panel session “CAD Research: Pay Now or Pay Later”. The panel presenters were tasked with addressing various issues about the CAD EDA industry. Some of the most important issues...
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Wafer:
MEPTEC’s (MicroElectronics Packaging and Test Engineering Council’s) Technical Symposium IC Packaging and Test Roadmaps, held November 16, 2006, explored future technology trends and solutions for packaging and test. As demand increases for...
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2006 Gary Smith EDA. All Rights Reserved.
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