Gary Smith EDA at DAC
Anaheim Hilton, Pacific Ballroom C Sunday June 13
Come hear Gary & Mary’s annual update on the state of EDA. Mary Olsson 3D Packaging Rises to the Level of Silicon
Advances in 3D package design are putting the "A" back in EDA. However, miscommunication and design gaps at the silicon level still impact packaging performance. Gary Smith Don’t Panic! SoC Costs "Will" Come Down
EDA Industry is in a state of panic right now. Don't worry, once we get the price of an SoC Design under $25M, we'll resume healthy revenue growth.
DAC Pavilion Panel Gary Smith on EDA: Trends and What's Hot at DAC
DAC Pavilion Panel, Booth 694
Monday June 14
Gary Smith of Gary Smith EDA reviews EDA's hottest technology trends. How will the dramatic changes in EDA, the semiconductor market and the design community affect you? What are the hot 'must sees' at this year's conference? Find out here!
Watch the very funny video:
DAC Management Day: Session 2: Trade-offs and choices for Emerging SOCs
Tuesday June 15
2:00-4:00 pm Session Chair: Gary Smith – Gary Smith EDA, Santa Clara, CA
Today's emerging SOCs require multiple types of optimizations and the adoption of advanced solutions to meet stringent design requirements. Optimizing for volume production, low power, and shrinking sizes necessitates accurate trade-off analysis and technical/business decision-making by management. This session will feature senior managers of today's most complex nanometer chips
Mark Redford Vice President, Advanced Process Technology Development, CSR Robert Madge Director of Technology, and Prabhu Krishnamurthy, Director of Design Tools and Methodology, LSI Logic
Michael Jassowski Business & Technology Programs, Intel
Karim Arabi Director, Qualcomm, Inc.
Synopsys’ Conversation Central at DAC
DAC booth# 595 Wednesday June 16 12:30-1:00pm
Gary Smith interview by Rich Goldman, Synopsys
“Don’t Panic! (How SoC Costs Will Come Down)”
Be part of the discussion in person or remotely.