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"Surviving
Another Industry Downturn: A Time for Opportunities" |
Surviving Another Industry Downturn: A Time for Opportunities
- Industry Cycles
For some companies involved in the volatile electronics
industry, upturns and downturns are cyclical, challenging
and full of opportunities. Some companies take the challenges
and turn them into opportunities by:
- • Employing inventory management programs to reduce product
manufacturing
costs and prices
• Developing new contracts to maintain customer loyalty
and out-survive competitors
• Changing pricing strategies and contracts with foundry
partners
• Expanding IP partnerships
• Selling off or closing old fabs rather than invest in
upgrades
• Upgrade fabs for new products or technology: solar, MEMs,
etc.
• Developing multi-tiered prices and product lines
• Refocusing market strategies on new applications and new
users
• Acquiring companies to gain technology or engineering
expertise
• Qualifying tools and solutions for foundry manufacturing
processes
- In 2006 GSEDA made several recommendations on future growth
opportunities for EDA and chip designers:
• Increased production of 65nm and 45nm designs
• RF circuitry needs and competing strategies driving “exponential
growth in functionalities that must be integrated into the
same sized and same priced” SIP versus SOC
• Package-on-package (PoP) and die-to-die package solutions
• PCB and package design challenges would be new 4G wireless
applications that must remain “backward compatible with
3G/2G modes
• Concurrent team design infrastructures or models, between
“IC layout and manufacturing (foundries at front-end and
back-end) were needed to meet process effects, photolithography,
data volumes, and cost effective chip yield”. Applications
like those illustrated in Figure 1 were pushing the limits
of existing package, board and system design engineering
capabilities and EDA software tools.
Source: Cadence & GSEDA April
2009
Today multiple EDA companies now offer a variety of co-design
platforms or concurrent software sections to bridge the design
gaps from silicon to package and board to system. Their platforms
required more partnering with silicon and package foundries
and board to system level manufacturers. This perspective
will cover a selected number of companies that recently introduced
and compete in co-design platforms for both the front-end
and back-end of design.
EDA Vendors: Chip-Package-System Co-Design
There is a growing list of EDA vendors paying homage to the
chip foundry and SATS vendors to optimize interconnect across
the entire chip-package-board domain via co-design solutions.
By taking an aggressive position in co-design they build customer
relationships and see it as an opportunity to get ahead of
competitors. Two specific EDA companies significantly involved
in the introduction of advanced co-design platforms are Apache
Design Solutions and Agilent EEsof EDA Division. Both companies
partner or work with the two largest suppliers of concurrent
Package-Board-System co-design solutions: Cadence and Mentor
Graphics.
Apache Design Solutions, a start-up founded in the 2001 downturn,
acquired Optimal in 2007. Optimal’s technology base included
3D power, signal, and thermal analysis solutions for packages,
System-in-package (SIP) and board designs. Today Apache claims
to lead the EDA industry with 100% focus on power and noise
analysis co-design solutions from IC to the package domain
via their Sentinel product. The Sentinel product line is targeted
at 45nm and below designs with special emphasis on 3D and
TSVs (through silicon vias).
Agilent EEsof introduced its ADS 2009 HF/High speed front
end (simulation and verification) co-design platform in 2009.
Their front-end solution is in contrast to the Cadence and
Mentor back-end co-design platforms. The ADS 2009 co-design
“sweet-spot” is their strength in the RF domain. As stated
by Agilent “the RF physical layer of any wireless system requires
the successful integration of mutli-technology components
to meet wireless system specs such as LTE, WiMax, WiMedia,
Wireless HD, etc.
Concurrent Infrastructures
The EDA industry currently does not have a concurrent software
development infrastructure in place. However, companies like
Agilent EEsof, Apache, Cadence and Mentor; are pushing the
limits of software technology to achieve interoperability.
No one company has yet to achieve a complete software model
from concept to complete system. As noted by GSEDA in November
2008, the cost of developing embedded software across the
entire food chain is excessive. In 2007 the cost of developing
the embedded software for an SOC (System On Chip) or an NOC
(Network On Chip) passed the cost of designing the SOC/NOC.
Advancements in Co-Design
As noted by all four companies co-design of an IC, package/module
and board before fabrication, or as soon as they become available
either in the form of simulated designs or off-the-shelf parts
reduces the risk of failure and delay. “If one extrapolates
this risk reduction to a complex wireless or hi-speed communication
system, the ROI is significant in the reduction of time, as
it shortens the design cycles, and cost of work”.
Mary Ann Olsson |