Gary Smith EDA Consulting in Electronic Design
Gary Smith EDA (GSEDA) is the leading provider of market intelligence and advisory services for the global Electronic Design Automation (EDA), Electronic System Level (ESL) design, and related technology markets.
Gary Smith EDA
P.O. Box 2990
Santa Clara, CA 95055
phone +1 (408) 985-2929
fax +1 (408) 985-6611
Asian office
P.O.BOX 112-315 Taipei
Taipei City 10499
Taiwan (R.O.C)
Gary Smith •
[email protected]
phone +1 (408) 985-2929
fax +1 (408) 985-6611
Areas of focus: EDA, ESL and Electronic Design Methodology
Mary Olsson •
[email protected]
phone +1 (408) 356-8121
mobile +1 (408) 348-1899
Areas of focus: PCB, FPGAs, Analog and RF design tools, Semiconductor
IDMs and Fabless Semiconductor vendors
Nancy Wu
• [email protected]
Areas of focus: Heads up Asian office in Taipei, Taiwan supporting
all areas of inquiry
Laurie Balch •
[email protected]
Areas of focus: Forecasting and Statistics
Sharon Tan •
[email protected]
Areas of focus: User Wants & Needs Reports
Daya Nadamuni
• [email protected]
Areas of focus: Embedded Software, Multi-Core and ESL
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InfoTech-2013 in China
Sat June 22, 2013 8:00 am
Advances in SoC Design
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DAC Pavilion Panel
Mon June 03, 2013 9:15-10:15am
EDA Trends and What's Hot
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Cooley's DAC Troublemaker
Mon June 03, 2013 3:00-4:00
Annual Panel, Ballroom G
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GSEDA Sunday Night at DAC
Sun June 02, 2013 5:00-5:30pm
Convention Ctr Ballrm ABC
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2013 Market Trends v2
RTL and PCB market share, forecast & analysis by sub-apps
Publish date: Nov 2013 -
2013 Market Forecast
5 year future projections for industry growth
Publish date: June 2013 -
DATE review
2013 Review of the DATE show
Publish date: June 2013 -
2013 Market Trends v1
ESL and IC CAD market share, forecast & analysis by sub-apps
Publish date: Nov 2013 -
GSEDA Sunday Night @ DAC
Receive the full presentation of Gary's talk with EDA forecast
Publish date: June 2013
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Tech Online
Build, Borrow, Buy: New Approaches to Addressing Software Complexity -
Cadence
The Denali Party by Cadence -
Cadence blogs
Cadence DAC 2013 and Denali Party Update -
Cadence blogs
Panel: 3D-IC Design Experts Tackle “Practical Issues” in 2.5D and 3D TSV Deployment -
Cadence blogs
Electronic System Level (ESL) Design Gets a Pragmatic Look at EDPS Workshop